SMT MANUFACTURING SEMINAR The explosive growth of high-density SMT packaging has had a major impact on companies that design and manufacture electronic equipment. As market pressures make it necessary for designers to pack more features into smaller volumes, they strongly influence choices of IC package style, PCB design, material selection and manufacturing processes. This course was designed to explain SMT design and manufacturing, principles while confronting the technical and economic issues that accompany the choice of a design/packaging approach such as: Can I assemble and test high-density SMT assemblies with my current manufacturing equipment? Are my soldering process capabilities compatible with the requirements of these new SMT device packages? What happens to in-line PC board inspection if the solder joints aren't visually accessible? How can I maintain adequate control of my product performance and quality if I use the services of a contract manufacturer? The step-by-step instructional approach integrates videotapes and show-and-tell samples that explain major facets of SMT manufacturing from board fabrication through assembly line processes. Throughout the workshop attendees will have exposure to "real world" case studies in SMT implementation drawn from the instructor's experience. Open discussion periods are scheduled where your specific SMT questions can be addressed. The information presented in this seminar will provide all members of your SMT implementation team with the technical background and practical insights into what works and what doesn't work in designing and manufacturing your electronic assemblies. You Will Learn Basic knowledge of the design, packaging and manufacturing processes needed to produce high quality, reliable SMT assemblies The technical and economic advantages and disadvantages of various package types including BGAs, Flip Chips, Chip Scale Packages, MCMs and Direct Chip Attachment Important changes in PCB layout, manufacturing processes and electrical testing that must be implemented to successfully incorporate advanced technology packages into your products Equipment Considerations Options in Quality Function Deployment How to work with Contract Manufacturers Who Should Attend System/Circuit Design and Packaging Printed Circuit Board Layout Manufacturing Process Development Quality, Reliability & Test Managers and other members of the Design/Manufacturing Team involved in the selection and specification of electronic packaging and interconnection components will also benefit. "Very good anecdotes." "Real-world examples used to help explain." "Bob Hanson is very knowledgeable but most importantly he explains how things work." Participants in Mr. Hanson's courses COURSE OUTLINE, SMT MANUFACTURING Day 1 - AM Board Design and Layout Guidelines for Manufacturability Routing PCB Density Protective coatings Solder Masks Fiducials and Tooling Holes Issues of PCB Design and Layout for High-Density Pinout Configurations PCB Layers Vias Standard Cells Signal Quality PCB Material PCB Material Characteristics Student Participation Day 1 - PM Conventional Packages R's, C's, Diodes, beads and inductors SMT Components Thermal shock and joint failures Packaging methods Integrated Circuit Trends IC Density, IC Chip Size, IC Feature Size IC Performance, IC Operating Voltage Flip Chip, DCA, C4, COB, Micro BGA, CSP ASICs and MCMs Emerging Packages: BGAs CBGA Packages PCB Assembly of CBGAs PBGA Packages PCB Assembly of PBGAs Rework of PBGAs/CBGAs Popcorn effects and solutions of BGAs Advantages and disadvantages of BGAs Mounting SMT and NSMD pads vias in pads versus vias on stringers Multichip Module technologies MCM-C, MCM-L, PCMCIA Future Packaging Directions Student Participation: X8 magnifiers are provided for students to observe the significant features of the components and packages introduced during the presentation. Day 2 - AM Board Fabrication and Printing Stencils What type, accuracy, paste release and aperture considerations for advanced packaging components? Squeegees Solder Paste Solder Substitutes Fine Pitch Technology Printing Printing Day 2 - PM Component Attachment and Robotic Assembly Machine Placement Sequences for Manufacturing of SMT PCBs SMT only on top side SMT and through hole (TH) top side TH top side, SMT bottom side SMT both sides SMT both sides, TH top side Manufacturing cost ratios for each configuration Glue Dots Placement Machines Feeders Chip Shooters and Pick and Place Machines Day 3 - AM Soldering Reflow Soldering Basic Steps in Soldering Soldering Problems Wave Soldering Soldering Considerations for Fine Pitch and Ultra Small Solder Bricks Soldering Methods Factors Influencing Poor Quality Soldering Beam Welding and Hot Bar vs. Reflow Day 3 - PM Cleaning Types of Solder, Contamination, Cleaning Chemistries, Cleaning, Cost Studies, Contamination Removal Cleaning Issues of Advanced Packages Issues of cleaning under small standoff packages Can contamination be removed from under small standoff packages? What about SIR and fidelity at high frequency? What about dendrite growth due to fine line trace spacing? Quality, Vision and Repair Manufacturing Defects - Random and cyclic Rework Stations Repair of the Board Laminography, X-ray, A01, Laser Industry Examples of Error Profiles and SPC in SMT Manufacturing www.americomseminars.com REGISTRATION INFORMATION Send the below requested information to: E-mail: americomseminars@aol.com Fax: 775-883-2384 Phone: 1-800-650-3033 (outside US, 360-479-0949) Mail the form to Americom Seminars, Inc.; 2533 No. Carson Street, Suite 4213; Carson City NV 89706 Sign up on our web page: www.americomseminars.com Share this seminar with colleagues who would benefit INFORMATION WE NEED 1. Session you wish to attend: -- Check our web page for the latest public seminars www.americomseminars.com -- or, Write down suggested dates for a seminar for your company 2. Name 3. Job Title 4. Company/Organization 5. Address 6. City, State, Zip 7. Work Phone (with area code) 8. Fax No. (with area code) 9. E-mail address 10. HOW DO YOU WISH TO PAY? --You can pay with credit card on our secure web site at: www.americomseminars.com --You can pay by check or money order or purchase order as well. SEE OUR WEB PAGE FOR FEES. www.americomseminars.com The three-day fee includes the following for each student: Two full days of instruction covering Surface Mount Technology Manufacturing Comprehensive course notes Certificate of Completion indicating your participation in the course The six-day fee also includes Two additional days of instruction covering Test Additional comprehensive course notes. Students at public seminars also receive Continental breakfast, lunch, and refreshments daily Firms that send three or more attendees to public seminars receive a $75 discount per person for 3-day seminars; $150 per person for 6-day seminars. PAYMENT · Checks or Money Orders made to Americom Seminars, Inc. · VISA, MasterCard, American Express, Discover · Purchase Orders; 10% fee for P.O.'s, waived if paid within 30 days of the invoice date. CANCELLATIONS You may cancel your enrollment up to 15 days prior to the seminar, but you must pay a $100 processing fee. Cancellations 2 to 14 days before the seminar pay a $250 fee ($150 for 1 day class). Cancellations the day before or day of the seminar, owe the full amount. You may substitute enrollees at any time. If this course is not held for any reason, Americom Seminars, Inc.'s liability is limited to refund of the full course fee. Questions: Email us at americomseminars@aol.com Call us at 1-800-650-3033 (outside U.S., call 360-479-0949) Write us at: Americom Seminars; 2533 North Carson Street Suite 4213; Carson City NV 89706 Lodging Options See our web page for this information. www.americomseminars.com Note: Lodging is not included in course fee. Questions: Email us at americomseminars@aol.com Call us at 1-800-650-3033 (outside U.S., call 360-479-0949) Write us at: Americom Seminars, Inc.; 2533 North Carson Street Suite 4213; Carson City NV 89706 Contact us about a private seminar at your location! You can register at www.americomseminars.com