Robert Hanson, M.S.E.E., President, Americom Seminars, Internationally Recognized Expert with over 40 years of experience. Americom Seminars has provided outstanding electrical engineering seminars for over 15 years! Mr. Hanson teaches a variety of courses. Choose from any of Robert Hanson's renowned high technology seminars. Each is carefully designed to meet your needs and Mr. Hanson comes to your location. Brochure to e-mail to colleagues Return to main page www.americomseminars.com

Choose the seminar you are interested in for more information. Mr. Hanson will present to your company on your schedule. One person, several people, many people can attend; Mr. Hanson can present on ANY day of the week and can present during the mornings, afternoons, and evenings. SMT Manufacturing Seminar Usually 3 days This course does not require an electronics background. The explosive growth of high-density SMT packaging has had a major impact on companies that design and manufacture electronic equipment. As market pressures make it necessary for designers to pack more features into smaller volumes, they strongly influence choices of IC package style, PCB design, material selection and manufacturing processes. This course was designed to explain SMT design and manufacturing principles while confronting the technical and economic issues that accompany the choice of a design/packaging approach such as: Can I assemble and test high-density SMT assemblies with my current manufacturing equipment? Are my soldering process capabilities compatible with the requirements of these new SMT device packages? What happens to in-line PC board inspection if the solder joints aren't visually accessible? How can I maintain adequate control of my product performance and quality if I use the services of a contract manufacturer? The step-by-step instructional approach integrates videotapes and show-and-tell samples that explain major facets of SMT manufacturing from board fabrication through assembly line processes. Throughout the workshop attendees will have exposure to "real world" case studies in SMT implementation drawn from the instructor's experience. Open discussion periods are scheduled where your specific SMT questions can be addressed. The information presented in this seminar will provide all members of your SMT implementation team with the technical background and practical insights into what works and what doesn't work in designing and manufacturing your electronic assemblies. Got questions about a seminar at your location? Info and Fees for having a seminar at your site! Email us at americomseminars@aol.com Benefits of attending the SMT Manufacturing Seminar You Will Learn Basic knowledge of the design, packaging and manufacturing processes needed to produce high quality, reliable SMT assemblies The technical and economic advantages and disadvantages of various package types including BGAs, Flip Chips, Chip Scale Packages, MCMs and Direct Chip Attachment Important changes in PCB layout, manufacturing processes and electrical testing that must be implemented to successfully incorporate advanced technology packages into your products Equipment Considerations Options in Quality Function Deployment How to work with Contract Manufacturers Who Should Attend System/Circuit Design and Packaging Printed Circuit Board Layout Manufacturing Process Development Quality, Reliability & Test Managers and other members of the Design/Manufacturing Team involved in the selection and specification of electronic packaging and interconnection components will also benefit.  Text Included: “SMT Manufacturing Principles & Practices” by Robert J. Hanson Got questions about a seminar at your location? Info and Fees for having a seminar at your site! Email us at americomseminars@aol.com SMT Manufacturing Course Outline This course is for anyone who wishes to enhance their understanding of SMT. Board Design and Layout Guidelines for Manufacturability • Routing • PCB Density • Protective coatings • Solder Masks • Fiducials and Tooling Holes Issues of PCB Design and Layout for High-Density Pinout Configurations • PCB Layers • Vias • Standard Cells • Signal Quality • PCB Material • PCB Material Characteristics • Student Participation Conventional Packages • R's, C's, Diodes, beads and inductors • SMT Components • Thermal shock and joint failures • Packaging methods Integrated Circuit Trends • IC Density, IC Chip Size, IC Feature Size • IC Performance, IC Operating Voltage • Flip Chip, DCA, C4, COB, Micro BGA, CSP • ASICs and MCMs Emerging Packages: BGAs • CBGA Packages • PCB Assembly of CBGAs • PBGA Packages • PCB Assembly of PBGAs • Rework of PBGAs/CBGAs • Popcorn effects and solutions of BGAs • Advantages and disadvantages of BGAs • Mounting SMT and NSMD pads vias in pads versus vias on stringers • Multichip Module technologies • MCM-C, MCM-L, PCMCIA Future Packaging Directions Student Participation: X8 magnifiers are provided for students to observe the significant features of the components and packages introduced during the presentation. Board Fabrication and Printing • Stencils • What type, accuracy, paste release and aperture considerations for advanced packaging components? • Squeegees • Solder Paste • Solder Substitutes • Fine Pitch Technology Printing • Printing Component Attachment and Robotic Assembly • Machine Placement Sequences for Manufacturing of SMT PCBs • SMT only on top side • SMT and through hole (TH) top side • TH top side, SMT bottom side • SMT both sides • SMT both sides, TH top side • Manufacturing cost ratios for each configuration • Glue Dots • Placement Machines • Feeders • Chip Shooters and Pick and Place Machines Soldering • Reflow Soldering • Basic Steps in Soldering • Soldering Problems • Wave Soldering Soldering Considerations for Fine Pitch and Ultra Small Solder Bricks • Soldering Methods • Factors Influencing Poor Quality Soldering • Beam Welding and Hot Bar vs. Reflow Cleaning • Types of Solder, Contamination, Cleaning Chemistries, Cleaning, Cost Studies, Contamination Removal Cleaning Issues of Advanced Packages • Issues of cleaning under small standoff packages • Can contamination be removed from under small standoff packages? • What about SIR and fidelity at high frequency? • What about dendrite growth due to fine line trace spacing? Quality, Vision and Repair • Manufacturing Defects - Random and cyclic • Rework Stations • Repair of the Board • Laminography, X-ray, A0I, Laser • Industry Examples of Error Profiles and SPC in SMT Manufacturing Got questions about a seminar at your location? Info and Fees for having a seminar at your site! Email us at americomseminars@aol.com Comments about the web pages, contact Jim Hanson at hansonjb@gmail.com www.americomseminars.com

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Comments about the web pages, contact Jim Hanson at hansonjb@gmail.com