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Robert Hanson, M.S.E.E.,
President, Americom Seminars, Internationally
Recognized Expert with over 35 years of experience. Americom Seminars has provided outstanding
electrical engineering seminars for over 16 years! Mr.
Hanson teaches a variety of courses. Brochure to e-mail to colleagues Return to main page |
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Choose
the seminar you are interested in for more information. Mr.
Hanson will present to your company on your schedule. One person, several
people, many people can attend; Mr. Hanson can present on ANY day of the week
and can present during the mornings, afternoons, and evenings.
Usually 3 days This course does not require an electronics background. The
explosive growth of high-density SMT packaging has had a major impact on
companies that design and manufacture electronic equipment. As market pressures
make it necessary for designers to pack more features into smaller volumes,
they strongly influence choices of IC package style, PCB design, material
selection and manufacturing processes. This course was designed to explain
SMT design and manufacturing principles while confronting the technical and
economic issues that accompany the choice of a design/packaging approach such
as:
The
step-by-step instructional approach integrates videotapes and show-and-tell
samples that explain major facets of SMT manufacturing from board fabrication
through assembly line processes. Throughout the workshop attendees will have
exposure to "real world" case studies in SMT implementation drawn
from the instructor's experience. Open discussion periods are scheduled where
your specific SMT questions can be addressed. The information presented in
this seminar will provide all members of your SMT implementation team with
the technical background and practical insights into what works and what
doesn't work in designing and manufacturing your electronic assemblies. Got questions about a seminar at your location? Info
about having a seminar at your site! Email us at americomseminars@aol.com Benefits of attending the SMT Manufacturing Seminar You Will Learn
Who
Should Attend
Text Included:
SMT Manufacturing Principles & Practices by Robert J. Hanson Got questions about a seminar at your location? Info
about having a seminar at your site! Email us at americomseminars@aol.com SMT Manufacturing Course Outline This course is for anyone who
wishes to enhance their understanding of SMT. Board Design and Layout
Guidelines for Manufacturability Routing PCB Density Protective coatings Solder Masks Fiducials
and Tooling Holes Issues of PCB Design and
Layout for High-Density Pinout Configurations PCB Layers Vias Standard Cells Signal Quality PCB Material PCB Material Characteristics Student Participation Conventional Packages R's, C's, Diodes, beads and inductors
SMT Components Thermal shock and joint failures Packaging methods Integrated Circuit
Trends IC Density, IC Chip Size, IC Feature
Size IC Performance, IC Operating Voltage Flip Chip, DCA, C4, COB, Micro BGA,
CSP ASICs and MCMs Emerging Packages: BGAs CBGA Packages PCB Assembly of CBGAs
PBGA Packages PCB Assembly of PBGAs
Rework of PBGAs/CBGAs
Popcorn effects and solutions of BGAs Advantages and disadvantages of BGAs Mounting SMT and NSMD pads vias in pads versus vias on
stringers Multichip
Module technologies MCM-C, MCM-L, PCMCIA Future
Packaging Directions Student
Participation: X8 magnifiers are provided for students to observe the
significant features of the components and packages introduced during the
presentation. Board Fabrication and
Printing Stencils What type, accuracy, paste release
and aperture considerations for advanced packaging components? Squeegees Solder Paste Solder Substitutes Fine Pitch Technology Printing Printing Component Attachment and
Robotic Assembly Machine Placement Sequences for
Manufacturing of SMT PCBs SMT only on top side SMT and through hole (TH) top side TH top side, SMT bottom side SMT both sides SMT both sides, TH top side Manufacturing cost ratios for each
configuration Glue Dots Placement Machines Feeders Chip Shooters and Pick and Place
Machines Soldering Reflow Soldering Basic Steps in Soldering Soldering Problems Wave Soldering Soldering Considerations
for Fine Pitch and Ultra Small Solder Bricks Soldering Methods Factors Influencing Poor Quality
Soldering Beam Welding and Hot Bar vs. Reflow Cleaning Types of Solder, Contamination,
Cleaning Chemistries, Cleaning, Cost Studies, Contamination Removal Cleaning Issues of
Advanced Packages Issues of cleaning under small
standoff packages Can contamination be removed from
under small standoff packages? What about SIR and fidelity at high
frequency? What about dendrite growth due to fine line trace spacing? Quality, Vision and
Repair Manufacturing Defects - Random and
cyclic Rework Stations Repair of the Board Laminography,
X-ray, A0I, Laser Industry Examples of Error Profiles
and SPC in SMT Manufacturing Got questions about a
seminar at your location? Info about having a seminar at your site! Email us at americomseminars@aol.com Comments
about the web pages, contact Jim Hanson at hansonjb@gmail.com
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Americom Seminars provides exceloin us at an Americom Seminar!
Comments
about the web pages, contact Jim Hanson at hansonjb@gmail.com |