Robert Hanson, M.S.E.E., President, Americom Seminars, Internationally Recognized Expert with over 40 years of experience. Americom Seminars has provided outstanding electrical engineering seminars for over 25 years! Mr. Hanson teaches a variety of courses. Choose from any of Robert Hanson's renowned high technology seminars. Each is carefully designed to meet your needs and Mr. Hanson comes to your location. Return to main page www.americomseminars.com

Choose the seminar you are interested in for more information. Mr. Hanson will present to your company on your schedule. One person, several people, many people can attend; Mr. Hanson can present on ANY day of the week and can present during the mornings, afternoons, and evenings. ESSENTIAL STEPS FOR SIGNAL INTEGRITY: HIGH SPEED DIGITAL DESIGN SEMINARS for Non-EEs The vast majority of digital designs today require disciplines of high-speed technology through all stages of the development process. Personnel responsible for the PCB layout, coordinating with bareboard manufacturer and overseeing the assembly processes need to be familiar with high-speed technology. The non-experts course provides insights into why high-speed boards require specific layer stacking, routing spaces and traces, keep away areas and power/ground layer requirements. For mechanical/thermal personnel, the requirements of heat transfer, PCB rigidity and component types become important issues. Parts procurement is also important today. Why are certain types of resistors, ICs and capacitors needed for high speed? Why can’t we substitute and why are the lead times so long? All of the above issues are discussed in a jargon-free, simple math environment. After attending this tutorial, students will have a clear understanding of the disciplines/risks associated with developing a high-speed product from CAE, CAD, bareboard manufacturing, assembly, test, prototyping, and integration with the customers. “Good industry applicability. He takes a very systematic approach to explaining his subject.” Participant in one of Mr. Hanson’s courses This course gives you clear and easy to understand instruction in the disciplines and risks associated with developing a high-speed product from CAE, CAD, bareboard manufacturing, assembly, test prototyping, and integration with the customers. The course covers: • Fundamentals of resistance, inductance & Capacitance • Logic Gates, Flip-flops, RAMs, ROMS, µps and FPGAs • High Speed Fundamentals • High Speed Logic Gates • Oscilloscope Signal Measurement Fundamentals • Practical applications of Ground and Signal Planes • How Transmission Lines operate • How a Printed Circuit is manufactured • Vias: Throughhole, Blind, Buried and Microvia • Power Distribution and Capacitance, and purposes of Tantelums, ceramics, and placement • Connectors and Cables: Types, EMI considerations, shielding, and cross-talk • Oscillators and Clock Distribution: Why separation and height from ground plane are so critical Got questions about a seminar at your location? Info and Fees for having a seminar at your site! Email us at americomseminars@aol.com Benefits of attending the Essential Steps for Signal Integrity: High Speed Digital Design for non-EEs Seminars This course is for: • CAD/PCB layout personnel • Design managers • Technicians • Project managers of high-speed designs • Mechanical engineers and other related disciplines Non-expert prerequisites The Non-experts course is for anyone who works with personnel designing today’s ICs, high-speed designs and high speed PCB. No math beyond high school algebra is required though attendees will find it helpful to bring a scientific calculator to the course. The speed of today’s logic devices mandates that the interconnects on PCBs must meet the high switching rise/fall times of these devices. Switching edges are in the 200ps to 300ps range and some devices have edges that have broken the 100ps barrier. This has resulted in high-speed design problems such as: • A lack of control over impedance and reflections • Crosstalk and coupling failures • Time delays, false triggering and reflections • Failure to meet EMI and FCC requirements It is the edge rate, not the frequency, which exacerbates this problem. So, even if your design is for moderate frequency, the edge rates can cause these designs to reflect the high-speed effects. Most designs today use a microprocessor and today’s micros have clock rates about 400 times higher than the original 8 and 16 bit machines. A key factor is the minimization of the semiconductor device (now at .15 mm) leading to less parasitic L and C and thereby faster switching rates. This phenomenon is also apparent in RAMs, ROMs, ASICs and Gate Arrays. This leads to PCBs requiring terminators, new CAD routing disciplines and component additions to minimize ground bounce effects. More and more designs are requiring these faster devices to meet more demanding specifications that match or beat the competition. The purpose of this cours is to provide you with the knowledge to do it right the first time. The courses provide tools for recognizing the problems with any proposed high-speed design. Design rules and design processes are taught that insure the PCB will function properly at the prototype stage. The courses emphasize cost competitive design without sacrificing high-speed integrity. Got questions about a seminar at your location? Info and Fees for having a seminar at your site! Email us at americomseminars@aol.com Essential Steps for Signal Integrity: High Speed Digital Design for PCB Layout Theory and Application for non-EEs Course Outline Fundamentals of electricity and electronics Science of electricity and electronics – matter, atoms, molecules, electrons, protons, neutrons, voltage, and current Series circuits – Kirchhoff’s voltage/current laws, voltage/current/ohms (resistance) in series circuits Parallel circuits – Kirchhoff’s voltage/current laws for parallel circuits, types of parallel circuits, voltage/current/power in parallel circuits Inductance and RL circuits – transients, transformers, serial and parallel inductance, real and reactive power, power factor, balancing inductive loads Capacitance – types, RC time constant, equivalent series and parallel capacitance, transient response, reactive power Fundamentals of Digital Design Basic electronic devices, applications, digital circuits, and computers Device construction – doping, diodes, transistors, FETS, LEDs, LCDs, flat panel displays Integrated circuits (IC) – IC construction, common types of ICs: MOS devices, CMOS, NMOS, PMOS, PLDs, FPGAs Amplifiers and linear ICs – NPN/PNP transistors, biasing, amplifier operation, voltage and current gain Digital circuits – binary numbering systems, bits and bytes, logic gates types (OR, NOR, AND, NAND, XOR), and flip-flops (D and JK) Computers – history, microprocessors and mini-computers, how a computers functions, memories (RAMs and PROMs), and storage technologies Memory storage ICs – operation and programming of ROMs, PROMs, EPROMs, EEPROMs, and flash RAM High Speed Fundamentals Frequency and Time Time and Distance Lumped Versus Distributed Systems Four Kinds of Reactance Ordinary Capacitance Ordinary Inductance High-Speed Properties of Logic Gates Terminators: Single, Split Pull Up and Down Speed Ground Bounce and Lead Inductance Electronic Packages: QFPs, PGAs, SOIC, PLCC, BGA, COB, TAB, FC, CSP and their relationship to Signal Integrity Thermal Considerations Measurement Techniques Rise Time and Bandwidth of Oscilloscope Probes Self-inductance of a Probe Ground Loop Viewing a Serial Data Transmission System Transmission Lines and Terminations Infinite Uniform Transmission Line Effects of Source and Load Impedance Line Impedance and Propagation Delay End Terminators Source Terminators Vias Mechanical Properties of Vias Capacitance of Vias Inductance of Vias Return Current and Its Relation to Vias Through Hole, Blind, Buried, and Micro Vias Ground Planes and Layer Stacking High-Speed Current Follows the Path of Least Inductance Crosstalk in Solid Ground Planes Guard Traces How to Stack Printed Circuit Board Layers Power Systems Providing a stable Voltage Reference Distributing Uniform Voltage Everyday Distribution Problems Choosing a Bypass Capacitor Connectors and Cables Mutual Inductance – How Connectors Create Crosstalk Series Inductance-How Connectors Create EMI Parasitic Capacitance—Using Connectors on a Multidrop Bus Special Connectors for High-Speed Applications Differential Signaling Through a Connector Power Handling Features of Connectors Clock Distribution/Clock Oscillation Clock Skew Using Low-Impedance Drivers Using Low-Impedance Clock Distribution Lines Source Termination of Multiple Clock Lines Controlling Crosstalk on Clock Lines Delay Adjustments Differential Distribution Clock Signal Duty Cycle The PCB Dielectric Constant and Dissipation Factor FR4, Teflon (PTFE) and Substitution Materials Layer Stackups, Power, Ground, and Signal Planes Tradeoffs of R, C, L, and Manufacturing Concerns Plating, Vias, CAM for Fast Turnaround High-Speed Development Tools Signal Integrity Tools Routing and Placement Timing Analysis Got questions about a seminar at your location? Info and Fees for having a seminar at your site! Email us at americomseminars@aol.com Comments about the web pages, contact Jim Hanson at hansonjb@gmail.com www.americomseminars.com

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Comments about the web pages, contact Jim Hanson at hansonjb@gmail.com