Robert Hanson, M.S.E.E., President, Americom Seminars, Internationally Recognized Expert with over 40 years of experience. Americom Seminars has provided outstanding electrical engineering seminars for over 25 years! Mr. Hanson teaches a variety of courses. Choose from any of Robert Hanson's renowned high technology seminars. Each is carefully designed to meet your needs and Mr. Hanson comes to your location. Return to main page www.americomseminars.com

Choose the seminar you are interested in for more information. Mr. Hanson will present to your company on your schedule. One person, several people, many people can attend; Mr. Hanson can present on ANY day of the week and can present during the mornings, afternoons, and evenings.

BGA SEMINARS LAYOUT TECHNIQUES, ROUTING, PCB STACKUPS, AND REWORK ISSUE This course begins with a brief description of ball grid array (BGA) terminology, followed by a description of substrate materials and how they affect board performance. You will learn a method of calculating layer requirements for BGAs based on package layouts. You will also learn routing techniques to reduce layer count when using BGAs. Got questions about a seminar at your location? Info and Fees for having a seminar at your site! Email us at americomseminars@aol.com WHO SHOULD ATTEND: This course is specifically recommended for System/Circuit Design Engineers, Printed Circuit Board Designers, Packaging, and Electrical Test Engineers. Managers and other members of the design/manufacturing team involved in the production, selection and specification of electronic packaging and interconnection components will also benefit significantly from the content of this course. HOW WILL YOU BENEFIT: Basic knowledge of the design, packaging and manufacturing processes needed to produce high quality, reliable BOA assemblies. Up-to-date information currently available for BOA package styles. Suggestions for working with a Bareboard Vendor and a Contract Manufacturer. TOPICS: · Types of grid arrays · Solder ball types · Substrates · Pad Size · BGA Escape Patterns · Power Delivery · Issues with 1 mm BGA · Placement · Copper fills, power trace width and solder mask · Rework Issue - Removal and placement of New Device Got questions about a seminar at your location? Info and Fees for having a seminar at your site! Email us at americomseminars@aol.com Comments about the web pages, contact Jim Hanson at hansonjb@gmail.com www.americomseminars.com

Americom Seminars provides exceloin us at an Americom Seminar!

Comments about the web pages, contact Jim Hanson at hansonjb@gmail.com