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Robert Hanson,
M.S.E.E., President, Americom Seminars,
Internationally Recognized Expert with over 40 years of experience. Americom Seminars has provided
outstanding electrical engineering seminars for over 25 years! Mr. Hanson teaches a variety of courses. Return to main page |
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Choose the seminar you are interested in for more
information. Mr. Hanson will present to your company on your schedule. One person, several people, many people can attend; Mr. Hanson
can present on ANY day of the week and can present during the mornings,
afternoons, and evenings. STEPS BEYOND FOR SIGNAL INTEGRITY:
ADVANCED HIGH SPEED DIGITAL DESIGN THEORY AND APPLICATION SEMINARS This three-day
course is tailored
to the high-speed digital design
engineer who wants to go a step beyond and delve into a deeper
understanding of high-speed phenomena. With edge rates ever decreasing and
clock rates becoming faster, it is vital that engineers understand the
underlying issues of the transmission line to insure signal integrity. Also,
bypassing these higher frequency edge rates and the ever increasing power of
today FPGAs and micros requires a better grasp of signal power switching.
PCBs are becoming more complex, with finer traces and spaces and more layers
with more blind and buried vias. This requires more
attention to controlling crosstalk, EMI and impedance control. This course
will cover 1) all transmission line loss concepts including the four
performance regions; 2) PCB effects for high speed transmission; 3) bypassing
high edge rate/high power ICs; 4) advanced concepts of single ended and
differential signaling and 5) how to overcome eye closure for high speed,
long haul transmission media (backplanes, motherboards and
connectors/cables). These and many more issues are presented along with
solutions that the leading edge companies are using to solve the ever increasing
sophistication of today’s state of the art designs. Got questions about a seminar at your location?
Info and Fees for
having a seminar at your site! Email
us at americomseminars@aol.com BENEFITS OF THIS COURSE ·
Deep, advanced knowledge of high-edge rate
and high-power device issues.
Practical applications are presented to address current and future
design issues. ·
Information that helps you layout traces on
PCB boards more efficiently because you will learn the effects of the PCB
parameters on high-speed transmission for both single-ended and differential
transmissions. ·
Exposure to the effects of transmission
line quality for GHz transmission and how pre-emphasis and equalization
techniques are implemented. The course
will help you to attain solutions for these situations more easily and
accurately. ·
Capability to properly bypass and control
power switching (PDS), a high-power IC/high-frequency (edge rate) digital
system. You will go that one “step
beyond” when you learn leading edge advanced concepts in bypassing for
high-edge rate and high-power devices. Got questions about a seminar at your location?
Info and Fees for
having a seminar at your site! Email
us at americomseminars@aol.com MATERIAL COVERED IN THIS COURSE Advanced High Speed Concepts Impedance of
structures to both clock rate harmonics and edge rate harmonics Resonance on
Transmission Lines: Serial and Parallel resonance. Quarter wave length
differences of high and low end impedance termination. Near field and far
field definitions and their effects on the magnetic and electric field
strengths The quality factor
for lumped circuitry: Why they can ring, crosstalk and cause EMI radiation Transmission Lines (TL) The TL
Cell-Defining, Rdc, Rac,
Skin Effect, Proximity, and the Dielectric Loss Current Travel on
TLs: Converting the B field to eddy currents and how it creates the skin
effect and proximity effect Characteristics of
PCB Material: What material is used for high frequency: DF, Cost, DFM, DFA Performance Regions The basic RLGC
cell and its effect on rising and falling edges The Lumped Element
region-parameters and model Practical
applications of the lumped model The RC Region of
the lumped model. Input/characteristic/Output impedance. Propagation
velocity, Elmore’s delay and lumped model algorithm The Constant Loss
Region: Boundary Conditions, propagation coefficient, resonance, termination
considerations The Skin Effect
Region: Boundary Conditions, characteristic impedance, propagation delay
parameters, termination options, speed, and distance Dielectric Region:
Boundary Conditions, characteristic impedance, dielectric loss/tangent loss,
propagation delay, resonance, terminationThe Printed Circuit Board (PCB) Modeling PCB
Traces Skin Effect and
Dielectric Loss for PCB Traces: microstrip and stripline Dielectric
Properties, relative costs and core/prepreg issues
for high speed stackups Effects of
temperature, frequency and mfg tolerance on
characteristic impedance Solder Mask and
Conformal Coating: effects on Z0, propagation delay and impedance
equations Matching
Capacitive and inductive loads using trace width modification Far end and Near
end Crosstalk: Inductive and capacitive for microstrips
and striplines Matching traces to
connectors: Minimizing reflections, crosstalk and EMI Vias: C and L of vias (through hole, blind, buried), via discontinuities
and eliminating reflections of vias Advanced Topics in Bypassing Shoot through
current and die capacitance Eliminating mode
conversion Why the 0201, the long
electrode and the Y cap may be essential to control switching impedance and
EMI radiation Breakout and
bypassing the 4, 5, 6 perimeter ring and fully populated BGA Do copperfills (pours) really help in bypassing? What is the
present status of innerplane C materials (FR4,
ceramic filled, and polymide) and how thin can they
practically be made? How much C is
needed and layout considerations for today’s FPGAs and micros Return current and
intelligent via placement Differential Signaling Attributes/drawbacks
of loosely/tightly coupled differential pairs Definition and
examples of differential and common mode V and I Differential
impedance: Odd and even modes Advantages and
disadvantages of Edge (side by side), Broadside (dual), asymmetric, and microstrip differentials Reflections and
crosstalk in differentials. Metastability, Clk skew, driver skew, bit pattern sensitivity, ISI, skin
effect and dielectric constant. Jitter, BER, and the eye diagram Matching
electrical lengths High Speed Clocking Clock skew and
jitter PLLs, DDLs,
serpentine traces and programmable delays Source and end
termination considerations for star, daisy chain and driving multiple loads Clock driving high
speed buses: RAMbus and address drivers, minimizing
the C load. Random and deterministic
jitter. Power Supply noise and Clk jitter High Speed Data Transmission Pre-emphasis and
equalization Techniques The effects of
ISI, Skin and dielectric losses The effect of
various base materials of long haul transmission. The effects of eye closure
on BER A real world
example of compensation techniques ·
“He is an outstanding instructor.” ·
“Thorough information.” Share this seminar with
colleagues Got questions about a seminar at your location?
Info and Fees for
having a seminar at your site! Email
us at americomseminars@aol.com Comments
about the web pages, contact Jim Hanson at hansonjb@gmail.com
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Comments about the web pages, contact
Jim Hanson at hansonjb@gmail.com