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Robert Hanson, M.S.E.E.,
President, Americom Seminars, Internationally
Recognized Expert with over 35 years of experience. Americom Seminars has provided outstanding electrical
engineering seminars for over 16 years! Mr.
Hanson teaches a variety of courses. Return to main page |
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Choose
the seminar you are interested in for more information. Mr.
Hanson will present to your company on your schedule. One person, several
people, many people can attend; Mr. Hanson can present on ANY day of the week
and can present during the mornings, afternoons, and evenings. ADVANCED HIGH SPEED DIGITAL DESIGN SEMINARS This three-day course is tailored to the high-speed digital design engineer who wants to go a step
beyond and delve into a deeper understanding of high-speed phenomena. With
edge rates ever decreasing and clock rates becoming faster, it is vital that engineers
understand the underlying issues of the transmission line to insure signal
integrity. Also, bypassing these higher frequency edge rates and the ever
increasing power of today FPGAs and micros requires
a better grasp of signal power switching. PCBs are becoming more complex,
with finer traces and spaces and more layers with more blind and buried vias. This requires more attention to controlling
crosstalk, EMI and impedance control. This course will cover 1) all
transmission line loss concepts including the four performance regions; 2)
PCB effects for high speed transmission; 3) bypassing high edge rate/high
power ICs; 4) advanced concepts of single ended and differential signaling
and 5) how to overcome eye closure for high speed, long haul transmission
media (backplanes, motherboards and connectors/cables). These and many more
issues are presented along with solutions that the leading edge companies are
using to solve the ever increasing sophistication of today’s state of the art
designs. Got questions about a seminar at your location? Info about having a seminar at your site! Email us at americomseminars@aol.com BENEFITS OF THIS COURSE ·
Deep, advanced knowledge of high-edge rate and high-power
device issues. Practical applications
are presented to address current and future design issues. ·
Information that helps you layout traces on PCB boards more
efficiently because you will learn the effects of the PCB parameters on
high-speed transmission for both single-ended and differential transmissions. ·
Exposure to the effects of transmission line quality for
GHz transmission and how pre-emphasis and equalization techniques are
implemented. The course will help you
to attain solutions for these situations more easily and accurately. ·
Capability to properly bypass and control power switching
(PDS), a high-power IC/high-frequency (edge rate) digital system. You will go that one “step beyond” when you
learn leading edge advanced concepts in bypassing for high-edge rate and
high-power devices. Got questions about a seminar at your location? Info about having a seminar at your site! Email us at americomseminars@aol.com MATERIAL COVERED IN THIS COURSE Advanced High Speed Concepts Impedance of structures to both
clock rate harmonics and edge rate harmonics Resonance on Transmission Lines: Serial
and Parallel resonance. Quarter wave length differences of high and low end
impedance termination. Near field and far field
definitions and their effects on the magnetic and electric field strengths The quality factor for lumped
circuitry: Why they can ring, crosstalk and cause EMI radiation Transmission Lines (TL) The TL Cell-Defining, Rdc, Rac, Skin Effect,
Proximity, and the Dielectric Loss Current Travel on TLs: Converting the B field to eddy currents and how it
creates the skin effect and proximity effect Characteristics of PCB Material:
What material is used for high frequency: DF, Cost, DFM, DFA Performance Regions The basic RLGC cell and its effect
on rising and falling edges The Lumped Element
region-parameters and model Practical applications of the
lumped model The RC Region of the lumped model.
Input/characteristic/Output impedance. Propagation velocity, Elmore’s delay
and lumped model algorithm The Constant Loss Region: Boundary
Conditions, propagation coefficient, resonance, termination considerations The Skin Effect Region: Boundary
Conditions, characteristic impedance, propagation delay parameters,
termination options, speed, and distance Dielectric Region: Boundary
Conditions, characteristic impedance, dielectric loss/tangent loss, propagation
delay, resonance, terminationThe Printed Circuit
Board (PCB) Modeling PCB Traces Skin Effect and Dielectric Loss
for PCB Traces: microstrip and stripline Dielectric Properties, relative
costs and core/prepreg issues for high speed stackups Effects of temperature, frequency
and mfg tolerance on characteristic impedance Solder Mask and Conformal Coating:
effects on Z0, propagation delay and impedance equations Matching Capacitive and inductive
loads using trace width modification Far end and Near end Crosstalk:
Inductive and capacitive for microstrips and striplines Matching traces to connectors:
Minimizing reflections, crosstalk and EMI Vias: C and L of vias
(through hole, blind, buried), via discontinuities and eliminating reflections
of vias Advanced Topics in Bypassing Shoot through current and die
capacitance Eliminating mode conversion Why the 0201, the long electrode
and the Y cap may be essential to control switching impedance and EMI
radiation Breakout and bypassing the 4, 5, 6
perimeter ring and fully populated BGA Do copperfills
(pours) really help in bypassing? What is the present status of innerplane C materials (FR4, ceramic filled, and polymide) and how thin can they practically be made? How much C is needed and layout
considerations for today’s FPGAs and micros Return current and intelligent via
placement Differential Signaling Attributes/drawbacks of
loosely/tightly coupled differential pairs Definition and examples of
differential and common mode V and I Differential impedance: Odd and
even modes Advantages and disadvantages of
Edge (side by side), Broadside (dual), asymmetric, and microstrip
differentials Reflections and crosstalk in
differentials. Metastability, Clk
skew, driver skew, bit pattern sensitivity, ISI, skin effect and dielectric
constant. Jitter, BER, and the eye diagram Matching electrical lengths High Speed Clocking Clock skew and jitter PLLs, DDLs,
serpentine traces and programmable delays Source and end termination considerations
for star, daisy chain and driving multiple loads Clock driving high speed buses: RAMbus and address drivers, minimizing the C load. Random and deterministic jitter.
Power Supply noise and Clk jitter High Speed Data Transmission Pre-emphasis and equalization
Techniques The effects of ISI, Skin and
dielectric losses The effect of various base
materials of long haul transmission. The effects of eye closure on BER A real world example of
compensation techniques ·
“He is an outstanding instructor.” ·
“Thorough information.” Share this seminar with colleagues Got questions about a seminar at your location? Info about having a seminar at your site! Email us at americomseminars@aol.com Comments about the web pages, contact Jim Hanson at hansonjb@gmail.com
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Comments about the web pages, contact Jim Hanson at hansonjb@gmail.com